Environment-friendly electronics : lead-free technology / Jennie S. Hwang

Includes bibliographical references and index

Introduction -- Industry trends -- Legislation & environment -- Fundamental technology and methodology -- Related patents -- Binary systems -- Sn/Ag/Bi system -- Sn/Ag/Cu system -- Sn/Ag/Sb system -- Sn/Ag/Bi/Cu system -- Sn/Ag/Bi/In system --Sn/Ag/Cu/In system -- Sn/Ag/Cu/Sb system -- Sn/Cu/Ga/In system -- Other ternary systems -- Other quaternary systems -- Pentanary and higher-element systems -- High-temperature and low-temperature lead-free solders -- Component leads and PCB surface finish -- Intermetallic compounds -- Compatibility of lead-free solders with the reflow process -- Microstructural evolution of Sn-Ag based lead-free solders -- Reliability of lead-free solders -- Conductive adhesives as a lead-free alternative -- Design of experiments for lead-free soldering -- Application considerations -- Effects of Pb contamination on lead-free solders -- The role of bismuth -- Common production defect guide -- Perspectives and views -- Comparison, selections and recommendations